IPC/EIA J-STD-028
Performance Standard for Construction of Flip Chip and Chip Scale Bumps
active, Most Current
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| Organization: | IPC |
| Publication Date: | 1 August 1999 |
| Status: | active |
| Page Count: | 36 |
scope:
This standard establishes the construction detail requirements for bumps and other terminal structures on flip chips and chip scale carriers. All flip chip and chip scale device terminals shall meet the designated standards detailed in this document which includes such diverse terminations as solder bumps, columns, non-melting stand-offs and conductive polymer deposits. The specific standards for different terminations will therefore be appropriately matched to the particular interconnection.
Document History
IPC/EIA J-STD-028
August 1, 1999
Performance Standard for Construction of Flip Chip and Chip Scale Bumps
This standard establishes the construction detail requirements for bumps and other terminal structures on flip chips and chip scale carriers. All flip chip and chip scale device terminals shall meet...