IPC - TM-650 2.4.43
Solder Paste - Solder Ball Test
active, Most Current
| Organization: | IPC |
| Publication Date: | 1 January 1995 |
| Status: | active |
| Page Count: | 3 |
scope:
This test is carried out to determine the reflow properties of the solder paste. The ability of the prealloyed solder particles in the paste to reflow into a sphere on a nonwettable substrate is determined under defined test conditions.
Document History
TM-650 2.4.43
January 1, 1995
Solder Paste - Solder Ball Test
This test is carried out to determine the reflow properties of the solder paste. The ability of the prealloyed solder particles in the paste to reflow into a sphere on a nonwettable substrate is...