DLA - SMD-5962-90864 REV A
MICROCIRCUIT, DIGITAL, HCMOS MULTIFUNCTION PERIPHERAL, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 25 October 1993 |
| Status: | active |
| Page Count: | 31 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Frequency Circuit function 01 68C901B-4 4.0 MHz HCMOS multifunction peripheral 02 68C901B-5 5.0 MHz HCMOS multifunction peripheral 03 68C901B-8 8.0 MHz HCMOS multifunction peripheral
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style x GDIP1-T48 or CDIP2-T48 48 Dual-in-Line y COCC1-N52 52 Leadless chip carrier z CMGA15-P68 68 Pin grid array 1/ u See figure 1 52 Leaded chip carrier
The Lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish Letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Supply voltage range, referenced to ground (VCC) . . . . . . . . −0.3 V dc to +7.0 V dc Input voltage . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V dc to +7.0 V dc Storage temperature range . . . . . . . . . . . . . . . . . . . −55°C to 150°C Maximum power dissipation (PD) . . . . . . . . . . . . . . . . . 55 mW Lead temperature (soldering, 10 seconds) . . . . . . . . . . . . +270°C Maximum operating junction temperature (TJ) . . . . . . . . . . +170°C Thermal resistance, junction-to-case (ΘJC): Cases X, Y and Z . . . . . . . . . . . . . . . . . . . . . . . See MIL-STD-1835 Case U . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10°C/W
Supply voltage range (VCC) . . . . . . . . . . . . . . . 4.5 V dc minimum to 5.5 V dc maximum High level input voltage range (VIH) . . . . . . . . . 2.0 V dc to VCC Low level input voltage range (VIL) . . . . . . . . . . −0.3 V dc to 0.8 V dc Frequency of operation: Device type 01 . . . . . . . . . . . . . . . . . . . 1.0 MHZ to 4.0 MHZ Device type 02 . . . . . . . . . . . . . . . . . . . 1.0 MHZ to 5.0 MHZ Device type 03 . . . . . . . . . . . . . . . . . . . 1.0 MHz to 8.0 MHZ Case operating temperature range (TC) . . . . . . . . . −55°C to +125°C
Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . XX percent 2/
intended Use:
microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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