IPC - 0040
Optoelectronics Assembly and Packaging Technology
|Publication Date:||1 May 2003|
This document addresses the implementation of optical and optoelectronic packaging technologies.
The areas discussed include: technology choices, design considerations, material properties, component mounting and interconnecting structures, assembly processes, testing, application, rework, and reliability of completed optoelectronic products. Optoelectronic packaging technologies include active and passive components and discrete fiber cable, their characteristics, and the manner that these parts will become an integral part of the functioning module, board or subassembly.
This document is intended to provide general information on implementing optical and optoelectronic packaging technologies, for creating component mounting structures and assemblies that may be exclusively optically oriented or that are to perform a combination of optical and electronic functions.