UNLIMITED FREE
ACCESS TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Select Your Free Newsletters

Industry Newsletters

Select Your Free Product Alerts

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

BSI - BS EN 60512-12-1

Connectors for electronic equipment Tests and measurements Part 12-1: Soldering tests Test 12a: Solderability, wetting, solder bath method

active, Most Current
Buy Now
Organization: BSI
Publication Date: 30 June 2006
Status: active
Page Count: 10
ICS Code (Plug-and-socket devices. Connectors): 31.220.10

Document History

BS EN 60512-12-1
June 30, 2006
Connectors for electronic equipment Tests and measurements Part 12-1: Soldering tests Test 12a: Solderability, wetting, solder bath method
A description is not available for this item.

References

This document references:
EN 60068-2-58 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Published by CENELEC on May 1, 2015
This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD). This document provides procedures for determining the solderability, resistance to dissolution of metallization...
This document references:
EN 60512-1-1 - Connectors for Electronic Equipment - Tests and Measurements Part 1-1: General Examination - Test 1a: Visual Examination
Published by CENELEC on April 1, 2002
A description is not available for this item.
This document references:
HD 323.2.20 S3 - Basic Environmental Testing Procedures Part 2: Tests Test T: Soldering
Published by CENELEC on January 1, 1992
A description is not available for this item.
This document references:
IEC 60068-2-20 - Environmental testing – Part 2-20: Tests – Tests Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
Published by IEC on March 1, 2021
This part of IEC 60068 outlines Tests Ta and Tb, applicable to devices with leads and leads themselves. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This...
This document references:
IEC 60068-2-58 - Environmental testing – Part 2-58: Tests – Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Published by IEC on July 1, 2017
This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD) This document provides procedures for determining the solderability, resistance to dissolution of metallization...
This document references:
IEC 60512-1-1 - Connectors for Electronic Equipment - Tests and Measurements - Part 1-1: General Examination - Test 1a: Visual Examination
Published by IEC on February 1, 2002
A description is not available for this item.
This document is referenced by:
BS EN 50548 - Junction boxes for photovoltaic modules
Published by BSI on June 30, 2011
A description is not available for this item.
This document is referenced by:
BS EN 60512-12-3 - Connectors for electronic equipment - Tests and measurements - Part 12-2: Soldering tests - Test 12b: Solderability, wetting, soldering iron method
Published by BSI on April 28, 2006
A description is not available for this item.
View Less
View All

Related Products

Searching for related products...

Advertisement