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BSI - BS EN 60512-12-3

Connectors for electronic equipment - Tests and measurements - Part 12-2: Soldering tests - Test 12b: Solderability, wetting, soldering iron method

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Organization: BSI
Publication Date: 28 April 2006
Status: active
Page Count: 8
ICS Code (Plug-and-socket devices. Connectors): 31.220.10

Document History

BS EN 60512-12-3
April 28, 2006
Connectors for electronic equipment - Tests and measurements - Part 12-2: Soldering tests - Test 12b: Solderability, wetting, soldering iron method
A description is not available for this item.
BS EN 60512-12-3
April 28, 2006
Connectors for electronic equipment Tests and measurements Part 12-3: Soldering tests Test 12c: Solderability, de-wetting
A description is not available for this item.

References

This document references:
IEC 60068-2-58 - Environmental testing – Part 2-58: Tests – Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Published by IEC on July 1, 2017
This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD) This document provides procedures for determining the solderability, resistance to dissolution of metallization...
This document references:
IEC 60512-12-2 - Connectors for electronic equipment – Tests and measurements – Part 12-2: Soldering tests – Test 12b: Solderability, wetting, soldering iron method
Published by IEC on February 1, 2006
A description is not available for this item.
This document references:
IEC 60512-1-1 - Connectors for Electronic Equipment - Tests and Measurements - Part 1-1: General Examination - Test 1a: Visual Examination
Published by IEC on February 1, 2002
A description is not available for this item.
This document references:
IEC 60512-12-1 - Connectors for electronic equipment – Tests and measurements – Part 12-1: Soldering tests – Test 12a: Solderability, wetting, solder bath method
Published by IEC on March 1, 2006
Scope and object This part of IEC 60512, when required by the detail specification, is used for testing connectors within the scope of technical committee 48. They may also be used for similar...
This document references:
EN 60068-2-58 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Published by CENELEC on May 1, 2015
This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD). This document provides procedures for determining the solderability, resistance to dissolution of metallization...
This document references:
EN 60512-1-1 - Connectors for Electronic Equipment - Tests and Measurements Part 1-1: General Examination - Test 1a: Visual Examination
Published by CENELEC on April 1, 2002
A description is not available for this item.
This document references:
EN 60512-12-1 - Connectors for electronic equipment - Tests and measurements Part 12-1: Soldering tests - Test 12a: Solderability, wetting, solder bath method
Published by CENELEC on May 1, 2006
A description is not available for this item.
This document references:
EN 60512-12-2 - Connectors for electronic equipment - Tests and measurements Part 12-2: Soldering tests - Test 12b: Solderability, wetting, soldering iron method
Published by CENELEC on March 1, 2006
A description is not available for this item.
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