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BSI - BS EN 62137-4

Electronics assembly technology Part 4: Endurance test methods for solder joint of area array type package surface mount devices

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Organization: BSI
Publication Date: 28 February 2015
Status: active
Page Count: 48
ICS Code (Electronic component assemblies): 31.190

Document History

BS EN 62137-4
February 28, 2015
Electronics assembly technology Part 4: Endurance test methods for solder joint of area array type package surface mount devices
A description is not available for this item.
BS EN 62137-4
February 28, 2015
Electronics assembly technology Part 4: Endurance test methods for solder joint of area array type package surface mount devices
A description is not available for this item.

References

This document references:
EN IEC 60068-2-14 - Environmental testing - Part 2-14: Tests - Test N: Change of temperature
Published by CENELEC on September 1, 2023
This document provides tests with specified ambient temperature changes to analyse their impacts on specimens.
This document references:
EN IEC 60068-2-21 - Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
Published by CENELEC on September 1, 2021
This part of IEC 60068 is applicable to all electrical and electronic components whose terminations or integral mounting devices are liable to be submitted to stresses during normal assembly or...
This document references:
EN IEC 61190-1-3 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
Published by CENELEC on March 1, 2018
This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic...
This document references:
EN IEC 61760-1 - Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
Published by CENELEC on September 1, 2020
This part of IEC 61760 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology. To this end, it specifies a reference set...
This document references:
IEC 62137-3 - Electronics assembly technology – Part 3: Selection guidance of environmental and endurance test methods for solder joints
Published by IEC on November 1, 2011
This part of IEC 62137 describes the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD), array...
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