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GMNA - 9984828

Low Bake, Solventborne Non-Conductive Rigid Primer for Plastics

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Organization: GMNA
Publication Date: 1 October 2016
Status: active
Page Count: 3
scope:

This specification covers the requirements for a solventborne, non-conductive, low bake primer for use over plastics, including those with in-mold coatings. The surfacer shall be smooth and an adhesion promoting surface. The surfacer must be sandable, and have the ability to fill minor surface imperfections in the substrate. It must also provide Ultraviolet (UV) light protection to any underlying coatings and substrates.

Material Description. This primer is part of the total painted product system and must provide a smooth, adhesion promoting coating direct to substrate or in-mold coating and to subsequent coatings. This specification shall be used in conjunction with the Approved Paint on Plastics Systems (APOPS), a section of the GM Materials Approved Source List, which lists the approved substrate, cleaning, priming, and topcoat combinations. APOPS test requirements are defined in GMW14797. Primers approved to this specification must cure and meet all performance requirements at a target bake temperature of 82 °C (180 °F).

Symbols. Not applicable.

Applicability. Primers covered under this specification are typically baked and applied to rigid plastic substrates that could lose functional or dimensional integrity at higher bake temperatures. They are used under an approved topcoat system.

Remarks. Not applicable.

Document History

April 1, 2022
Low Bake, Solventborne Non-Conductive Rigid Primer for Plastics
This specification covers the requirements for a solventborne, non-conductive, low bake primer for use over plastics, including those with in-mold coatings. The surfacer shall be smooth and an...
September 1, 2021
Low Bake, Solventborne Non-Conductive Rigid Primer for Plastics
This specification covers the requirements for a solventborne, non-conductive, low bake primer for use over plastics, including those with in-mold coatings. The surfacer shall be smooth and an...
9984828
October 1, 2016
Low Bake, Solventborne Non-Conductive Rigid Primer for Plastics
This specification covers the requirements for a solventborne, non-conductive, low bake primer for use over plastics, including those with in-mold coatings. The surfacer shall be smooth and an...
November 1, 2014
Low Bake, Solventborne Non-Conductive Rigid Primer for Plastics
This specification covers the requirements for a solventborne non-conductive low bake primer for use over plastics, including those with in-mold coatings. The surfacer shall be smooth and adhesion...
May 1, 2009
Low Bake, Nonconductive Rigid Primer for Plastics
This specification covers the requirements for a rigid, nonconductive primer surfacer for use over plastics, including those with in-mold coatings. The surfacer shall be smooth, adhesion promoting,...
October 1, 2005
Primer Surfacer - Low Bake, Nonconductive for Plastics
A description is not available for this item.
February 1, 1989
Primer Surfacer - Low Bake, Nonconductive for Plastics
1 SCOPE. This specification covers the requirements for a nonconductive primer surfacer for use over plastics, including those with in-mold coatings. The surfacer shall be smooth, adhesion promoting,...

References

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