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JEDEC JESD 22-A108

Temperature, Bias, and Operating Life

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Organization: JEDEC
Publication Date: 1 December 2016
Status: inactive
Page Count: 14
scope:

This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the devices' operating condition in an accelerated way, and is primarily for device qualification and reliability monitoring. A form of high temperature bias life using a short duration, popularly known as burn-in, may be used to screen for infant mortalityrelated failures. The detailed use and application of burn-in is outside the scope of this document.

Document History

JESD22-A108G
November 1, 2022
Temperature, Bias, and Operating Life
This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the devices’ operating condition in an accelerated way, and is primarily...
JEDEC JESD 22-A108
July 1, 2017
Temperature, Bias, and Operating Life
This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the devices’ operating condition in an accelerated way, and is primarily...
JEDEC JESD 22-A108
December 1, 2016
Temperature, Bias, and Operating Life
This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the devices’ operating condition in an accelerated way, and is primarily...
JEDEC JESD 22-A108
November 1, 2010
Temperature, Bias, and Operating Life
This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the devices' operating condition in an accelerated way, and is primarily...
JEDEC JESD 22-A108
June 1, 2005
Temperature, Bias, and Operating Life
A revised method for determining the effects of bias conditions and temperature, over time, on solid state devices is now available. Revision B of A108 includes low temperature operating life (LTOL)...
JEDEC JESD 22-A108
December 1, 2000
Temperature, Bias, and Operating Life
A description is not available for this item.
JEDEC JESD 22-A108
March 1, 1991
Bias Life (Revision of Test Method A108 - Previously Published in JESD22)
A description is not available for this item.
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References

This document references:
JEDEC JEP 122 - Failure Mechanisms and Models for Semiconductor Devices
Published by JEDEC on September 1, 2016
This publication provides a list of failure mechanisms and their associated activation energies or acceleration factors that may be used in making system failure rate estimations when the only...
This document references:
JEDEC JESD 47 - Stress-Test-Driven Qualification of Integrated Circuits
Published by JEDEC on August 1, 2018
This standard describes a baseline set of acceptance tests for use in qualifying electronic components as new products, a product family, or as products in a process which is being changed. These...
This document is referenced by:
IEC/TS 62861 - Guidelines for principal component reliability testing for LED light sources and LED luminaires
Published by IEC on March 1, 2017
This Technical Specification provides guidelines for establishing confidence in product reliability using principal component testing for LED light sources and LED luminaires for general lighting. It...
This document is referenced by:
IEC 60810 - Lamps, light sources and led packages for road vehicles – Performance requirements
Published by IEC on April 1, 2019
This document is applicable to filament lamps, discharge lamps, LED light sources and LED packages to be used in road vehicles, i.e. in headlamps, fog-lamps, signalling lamps and interior lighting....
This document is referenced by:
BS PD IEC TS 62686-1 - Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
Published by BSI on April 30, 2020
A description is not available for this item.
This document is referenced by:
BS PD IEC/TS 62861 - Guidelines for principal component reliability testing for LED light sources and LED luminaires
Published by BSI on March 31, 2017
A description is not available for this item.
This document is referenced by:
DIN IEC 60810 - Lamps, light sources and LED packages for road vehicles - Performance requirements (IEC 34A/1933/CDV:2016); German version prEN 60810:2016
Published by DIN on March 1, 2017
This International Standard is applicable to filament lamps, discharge lamps, LED light sources and LED packages to be used in road vehicles, i.e. in headlamps, fog-lamps, signalling lamps and...
This document is referenced by:
BS EN IEC 62668-2 - Process management for avionics — Counterfeit prevention Part 2: Managing electronic components from non-franchised sources
Published by BSI on September 30, 2019
A description is not available for this item.
This document is referenced by:
BS EN IEC 60810 + A2 - Lamps, light sources and led packages for road vehicles – Performance requirements
Published by BSI on February 28, 2018
A description is not available for this item.
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