DSF/FPREN 60749-3
Semiconductor devices – Mechanical and climatic test methods – Part 3: External visual examination
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| Organization: | DS |
| Status: | active |
| Page Count: | 13 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
The purpose of this part of IEC 60749 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance, or both.
Document History
June 19, 2017
Semiconductor devices – Mechanical and climatic test methods – Part 3: External visual examination
IEC 60749-3:2017(E) is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External...
December 23, 2003
Semiconductor devices – Mechanical and climatic test methods – Part 3: External visual examination
The purpose of this part of IEC 60749 is to verify that the materials, design, construction,markings, and workmanship of a semiconductor device are in accordance with the applicable porcurement...
September 23, 2002
Semiconductor devices – Mechanical and climatic test method – Part 3: External visual examination
The purpose of this part of IEC 60749 is to verify that the materials, design, construction,markings, and workmanship of a semiconductor device are in accordance with the applicable porcurement...
DSF/FPREN 60749-3
Semiconductor devices – Mechanical and climatic test methods – Part 3: External visual examination
The purpose of this part of IEC 60749 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement...