DS/EN 60749-3
Semiconductor devices – Mechanical and climatic test methods – Part 3: External visual examination
active, Most Current
| Organization: | DS |
| Publication Date: | 19 June 2017 |
| Status: | active |
| Page Count: | 17 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
IEC 60749-3:2017(E) is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance. This edition includes the following significant technical changes with respect to the previous edition: a) reference to the need for ESD protection; b) inclusion of information on the phenomenon of tin whiskers; c) inclusion of an optional report form/checklist.
Document History
DS/EN 60749-3
June 19, 2017
Semiconductor devices – Mechanical and climatic test methods – Part 3: External visual examination
IEC 60749-3:2017(E) is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External...
December 23, 2003
Semiconductor devices – Mechanical and climatic test methods – Part 3: External visual examination
The purpose of this part of IEC 60749 is to verify that the materials, design, construction,markings, and workmanship of a semiconductor device are in accordance with the applicable porcurement...
September 23, 2002
Semiconductor devices – Mechanical and climatic test method – Part 3: External visual examination
The purpose of this part of IEC 60749 is to verify that the materials, design, construction,markings, and workmanship of a semiconductor device are in accordance with the applicable porcurement...
Semiconductor devices – Mechanical and climatic test methods – Part 3: External visual examination
The purpose of this part of IEC 60749 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement...