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IPC-7711/7721

Rework, Modification and Repair of Electronic Assemblies

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Organization: IPC
Publication Date: 1 January 2017
Status: active
Page Count: 396
scope:

This document covers procedures for repairing and reworking printed board assemblies. It is an aggregate of information collected, integrated and assembled by the Repairability Subcommittee (7-34) of the Product Assurance Committee of the IPC. This revision includes expanded coverage for lead free processes, and additional inspection guidelines for operations such as repair that may not have other published criteria.

This document does not limit the maximum number of rework, modification or repair actions to a Printed Circuit Assembly.

Purpose This document prescribes the procedural requirements, tools, materials and methods to be used in the rework, repair, modification, overhaul or restoration of electronic products. Although this document is based in large part on the Product Class definitions used in IPC documents such as J-STD-001 or IPC-A-610, this document should be considered applicable to any type of electronic equipment. When invoked by contract as the controlling document for the rework, repair, modification, overhaul or restoration of products, the requirements flowdown apply.

IPC has identified the most common equipment and process in order to perform a specific repair or rework. It is possible that alternate equipment and processes can be used to make the same repair/rework. If alternate equipment or processes are used, it is up to the user to ensure the equipment/processes do not damage the assembly and meet the intent of Section 1.5.1.1 (Levels of Conformance) for the alternate equipment/processes utilized.

Document History

IPC-7711/7721
January 1, 2017
Rework, Modification and Repair of Electronic Assemblies
This document covers procedures for repairing and reworking printed board assemblies. It is an aggregate of information collected, integrated and assembled by the Repairability Subcommittee (7-34) of...
March 1, 2014
REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES
A description is not available for this item.
November 1, 2007
REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES
This document covers procedures for repairing and reworking printed board assemblies. It is an aggregate of information collected, integrated and assembled by the Repairability Subcommittee (7-34) of...
November 1, 2007
REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES
A description is not available for this item.
October 1, 2003
Rework of Electronic Assemblies; Repair and Modification of Printed Boards and Electronic Assemblies
This document covers procedures for repairing and reworking printed board assemblies. It is an aggregate of information collected, integrated and assembled by the Repairability Subcommittee (7-34) of...
February 1, 1998
Repair and Modification of Printed Boards and Electronic Assemblies
This document covers procedures for repairing and reworking printed board assemblies. It is an aggregate of information collected, integrated and assembled by the Repairability Subcommittee (7-34) of...
February 1, 1998
Rework of Electronic Assemblies
A description is not available for this item.
February 1, 1998
Rework of Electronic Assemblies
A description is not available for this item.

References

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