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IPC-7711/7721

Rework of Electronic Assemblies; Repair and Modification of Printed Boards and Electronic Assemblies

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Organization: IPC
Publication Date: 1 October 2003
Status: inactive
Page Count: 344
scope:

This document covers procedures for repairing and reworking printed board assemblies. It is an aggregate of information collected, integrated and assembled by the Repairability Subcommittee (7-34) of the Product Assurance Committee of the IPC.

 

Document History

IPC-7711/7721
July 1, 2020
Rework, Modification and Repair of Electronic Assemblies Amendment 1
A description is not available for this item.
IPC-7711/7721
January 1, 2017
Rework, Modification and Repair of Electronic Assemblies
This document covers procedures for repairing and reworking printed board assemblies. It is an aggregate of information collected, integrated and assembled by the Repairability Subcommittee (7-34) of...
IPC-7711/7721
March 1, 2014
REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES
A description is not available for this item.
IPC-7711/7721
November 1, 2007
REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES
This document covers procedures for repairing and reworking printed board assemblies. It is an aggregate of information collected, integrated and assembled by the Repairability Subcommittee (7-34) of...
IPC-7711/7721
November 1, 2007
REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES
A description is not available for this item.
IPC-7711/7721
October 1, 2003
Rework of Electronic Assemblies; Repair and Modification of Printed Boards and Electronic Assemblies
This document covers procedures for repairing and reworking printed board assemblies. It is an aggregate of information collected, integrated and assembled by the Repairability Subcommittee (7-34) of...
IPC-7711
February 1, 1998
Rework of Electronic Assemblies
A description is not available for this item.
IPC-7721
February 1, 1998
Repair and Modification of Printed Boards and Electronic Assemblies
This document covers procedures for repairing and reworking printed board assemblies. It is an aggregate of information collected, integrated and assembled by the Repairability Subcommittee (7-34) of...
IPC-7711
February 1, 1998
Rework of Electronic Assemblies
A description is not available for this item.
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References

This document is referenced by:
IPC-7095 - Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
Published by IPC on June 1, 2018
This standard describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design...
This document is referenced by:
IPC-A-610 - Acceptability of Electronic Assemblies
Published by IPC on October 1, 2017
This Standard is a collection of visual quality acceptability requirements for electronic assemblies. This Standard does not provide criteria for cross-section evaluation. This document presents...
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