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IPC - 2231A

DFX Guidelines

active, Most Current
Organization: IPC
Publication Date: 1 August 2021
Status: active
Page Count: 60
scope:

This document provides guidelines for establishing a best practice methodology for use in developing a formal DFX (Design for Manufacturing, Fabrication, Assembly, Testability, Cost, Reliability, Environment, Reuse) process for layout of printed board assemblies that utilize surface mount and through hole devices.

Purpose

The document provides a DFX process framework to establish a discipline of design review necessary to perform a detailed analysis of manufacturability attributes commonly found in electronics hardware for fabrication and around which to model a printed board assembly.

Goals of This Document The goals of this document are to:

• Use a multi-discipline engineering assessment tactic on elements influencing DFX.

• Allow the user to establish standardized DFX checklist(s) for major design elements such as bare printed board fabrication, printed board assembly manufacturing, electrical testability, and elements influencing product reliability, reuse, and impact on environment.

Limitations of This Document

Electronics hardware defined under this DFX review process is limited to features of influence on DFX for bare printed board and printed board assembly.

Document History

2231A
August 1, 2021
DFX Guidelines
This document provides guidelines for establishing a best practice methodology for use in developing a formal DFX (Design for Manufacturing, Fabrication, Assembly, Testability, Cost, Reliability,...
April 1, 2019
DFX Guidelines
This document provides guidelines for establishing a best practice methodology for use in developing a formal DFX (Design for Manufacturing, Fabrication, Assembly, Testability, Cost, Reliability,...

References

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