UNLIMITED FREE ACCESS TO THE WORLD'S BEST IDEAS

close
Already an Engineering360 user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your Engineering360 Experience

close
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

IPC-2231

DFX Guidelines

active, Most Current
Buy Now
Organization: IPC
Publication Date: 1 April 2019
Status: active
Page Count: 56
scope:

This document provides guidelines for establishing a best practice methodology for use in developing a formal DFX (Design for Manufacturing, Fabrication, Assembly, Testability, Cost, Reliability, Environment, Reuse) process for layout of printed board assemblies that utilize surface mount and through hole devices.

Purpose

The document provides a DFX process framework to establish a discipline of design review necessary to perform a detailed analysis of manufacturability attributes commonly found in electronics hardware for fabrication and around which to model a printed board assembly.

Document History

August 1, 2021
DFX Guidelines
This document provides guidelines for establishing a best practice methodology for use in developing a formal DFX (Design for Manufacturing, Fabrication, Assembly, Testability, Cost, Reliability,...
IPC-2231
April 1, 2019
DFX Guidelines
This document provides guidelines for establishing a best practice methodology for use in developing a formal DFX (Design for Manufacturing, Fabrication, Assembly, Testability, Cost, Reliability,...

References

Advertisement