scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is shown in the following examples.

For device classes M and Q:

For device class V:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device Type(s) identify the circuit function as follows:

Device Type Generic number Circuit function 01 AD524 Precision instrumentation amplifier

The device class designator is a single letter identifying the product assurance level as listed below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device.

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T-16 16 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage.............................. ±18 V dc Internal power dissipation.................. 280 mW Input voltage............................... ±V_S maximum Storage temperature range (T_STG) ........... −65° C to +150°C Lead temperature (soldering, 10 seconds).... +300°C Thermal resistance: Junction-to-case (θ_JC..................... See MIL-STD-1835 Junction-to-ambient (θ_JA): Case outline E ........................ 95°C/W Case outline 2 ........................ 150°C/W

Supply voltage range (V_S) .......................... ±6 Vdc to ±18 V dc Ambient operating temperature range (T_A)............. −55°C to +125°C

intended Use: