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JEDEC JESD 9

Inspection Criteria for Microelectronic Packages and Covers

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Organization: JEDEC
Publication Date: 1 May 2017
Status: active
Page Count: 82
scope:

This standard establishes the inspection criteria for metal and ceramic hermetic packages, individual feed throughs, and covers (lids).

Document History

JESD9C
May 1, 2017
Inspection Criteria for Microelectronic Packages and Covers
This standard establishes the inspection criteria for metal and ceramic hermetic packages, individual feed throughs, and covers (lids).
JEDEC JESD 9
May 1, 2017
Inspection Criteria for Microelectronic Packages and Covers
This standard establishes the inspection criteria for metal and ceramic hermetic packages, individual feed throughs, and covers (lids).
JEDEC JESD 9
May 1, 2011
Inspection Criteria for Microelectronic Packages and Covers
This standard establishes the inspection criteria for metal and ceramic hermetic packages, individual feed throughs, and covers (lids).
JEDEC JESD 9
January 1, 1987
Metal Package Specification for Microelectronic Packages and Covers
A description is not available for this item.

References

This document references:
MIL-PRF-38534 - HYBRID MICROCIRCUITS, GENERAL SPECIFICATION FOR
Published by NPFC on December 3, 2019
Scope. This specification establishes the general performance requirements for hybrid microcircuits, multi-chip modules (MCM) and similar devices, and the verification requirements for ensuring that...
This document references:
MIL-PRF-38535M - INTEGRATED CIRCUITS (MICROCIRCUITS) MANUFACTURING, GENERAL SPECIFICATION FOR
Published by DLA on November 1, 2022
Scope. This specification establishes the general performance requirements for integrated circuits or microcircuits and the quality and reliability assurance requirements, which are to be met for...
This document references:
MIL-STD-883 - TEST METHOD STANDARD MICROCIRCUITS
Published by NPFC on September 16, 2019
Purpose. This standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within Military and Aerospace electronic systems including basic...
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