JEDEC JESD 9
Metal Package Specification for Microelectronic Packages and Covers
inactive
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| Organization: | JEDEC |
| Publication Date: | 1 January 1987 |
| Status: | inactive |
| Page Count: | 49 |
Document History
May 1, 2017
Inspection Criteria for Microelectronic Packages and Covers
This standard establishes the inspection criteria for metal and ceramic hermetic packages, individual feed throughs, and covers (lids).
May 1, 2017
Inspection Criteria for Microelectronic Packages and Covers
This standard establishes the inspection criteria for metal and ceramic hermetic packages, individual feed throughs, and covers (lids).
May 1, 2011
Inspection Criteria for Microelectronic Packages and Covers
This standard establishes the inspection criteria for metal and ceramic hermetic packages, individual feed throughs, and covers (lids).
JEDEC JESD 9
January 1, 1987
Metal Package Specification for Microelectronic Packages and Covers
A description is not available for this item.