UNLIMITED FREE
ACCESS TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Select Your Free Newsletters

Industry Newsletters

Select Your Free Product Alerts

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

JEDEC JESD 9

Inspection Criteria for Microelectronic Packages and Covers

inactive
Buy Now
Organization: JEDEC
Publication Date: 1 May 2011
Status: inactive
Page Count: 82
scope:

This standard establishes the inspection criteria for metal and ceramic hermetic packages, individual feed throughs, and covers (lids).

Document History

JESD9C
May 1, 2017
Inspection Criteria for Microelectronic Packages and Covers
This standard establishes the inspection criteria for metal and ceramic hermetic packages, individual feed throughs, and covers (lids).
JEDEC JESD 9
May 1, 2017
Inspection Criteria for Microelectronic Packages and Covers
This standard establishes the inspection criteria for metal and ceramic hermetic packages, individual feed throughs, and covers (lids).
JEDEC JESD 9
May 1, 2011
Inspection Criteria for Microelectronic Packages and Covers
This standard establishes the inspection criteria for metal and ceramic hermetic packages, individual feed throughs, and covers (lids).
JEDEC JESD 9
January 1, 1987
Metal Package Specification for Microelectronic Packages and Covers
A description is not available for this item.

References

This document references:
MIL-PRF-38534 - HYBRID MICROCIRCUITS, GENERAL SPECIFICATION FOR
Published by NPFC on December 3, 2019
Scope. This specification establishes the general performance requirements for hybrid microcircuits, multi-chip modules (MCM) and similar devices, and the verification requirements for ensuring that...
This document references:
MIL-PRF-38535M - INTEGRATED CIRCUITS (MICROCIRCUITS) MANUFACTURING, GENERAL SPECIFICATION FOR
Published by DLA on November 1, 2022
Scope. This specification establishes the general performance requirements for integrated circuits or microcircuits and the quality and reliability assurance requirements, which are to be met for...
This document references:
MIL-STD-883 - TEST METHOD STANDARD MICROCIRCUITS
Published by NPFC on September 16, 2019
Purpose. This standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within Military and Aerospace electronic systems including basic...
This document is referenced by:
JEDEC JESD 88 - JEDEC Dictionary of Terms for Solid State Technology
Published by JEDEC on July 1, 2007
Each term and definition in this dictionary has been included strictly for application within the solid-state industry. Many of the terms and definitions in this dictionary may have applicability...
This document is referenced by:
JEDEC JEP 70 - Guide to Standards and Publications Relating to Quality and Reliability of Electronic Hardware
Published by JEDEC on October 1, 2013
This publication contains a listing and description of commonly used quality and reliability related publications applicable to the semiconductor industry. It is intended to be a reference aid in...
This document is referenced by:
JEP142 - Obtaining and Accepting Material for Use in Hybrid/MCM Products
Published by JEDEC on May 1, 2002
This document provides guidance regarding design considerations, material assessment techniques, and recommendations for material acceptance prior to use in Hybrid / MCM Products. As part of the risk...
View Less
View All
Advertisement