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BSI - BS EN 60749-43

Semiconductor devices - Mechanical and climatic test methods Part 43: Guidelines for IC reliability qualification plans

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Organization: BSI
Publication Date: 30 September 2017
Status: active
Page Count: 44
ICS Code (Semiconductor devices in general): 31.080.01

Document History

BS EN 60749-43
September 30, 2017
Semiconductor devices - Mechanical and climatic test methods Part 43: Guidelines for IC reliability qualification plans
A description is not available for this item.

References

This document references:
IEC 60749-11 - Semiconductor Devices - Mechanical and Climatic Test Methods - Part 11: Rapid Change of Temperature - Two-Fluid-Bath Method CORRIGENDUM 2
Published by IEC on August 1, 2003
A description is not available for this item.
This document references:
JEDEC JEP 122 - Failure Mechanisms and Models for Semiconductor Devices
Published by JEDEC on September 1, 2016
This publication provides a list of failure mechanisms and their associated activation energies or acceleration factors that may be used in making system failure rate estimations when the only...
This document references:
IEC 60749-29 - Semiconductor devices – Mechanical and climatic test methods – Part 29: Latch-up test
Published by IEC on April 1, 2011
Scope and object This part of IEC 60749 covers the I-test and the overvoltage latch-up testing of integrated circuits. This test is classified as destructive. The purpose of this test is to establish...
This document references:
EN 60749-42 - Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
Published by CENELEC on October 1, 2014
This part of IEC 60749 provides a test method to evaluate the endurance of semiconductor devices used in high temperature and high humidity environments. This test method is used to evaluate the...
This document references:
IEC 60749-5 - Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
Published by IEC on April 1, 2017
This part of IEC 60749 provides a steady-state temperature and humidity bias life test for the purpose of evaluating the reliability of non-hermetic packaged solid-state devices in humid...
This document references:
EN 60749-42 - Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
Published by CENELEC on October 1, 2014
This part of IEC 60749 provides a test method to evaluate the endurance of semiconductor devices used in high temperature and high humidity environments. This test method is used to evaluate the...
This document references:
IEC 60749-11 - Semiconductor Devices - Mechanical and Climatic Test Methods - Part 11: Rapid Change of Temperature - Two-Fluid-Bath Method CORRIGENDUM 2
Published by IEC on August 1, 2003
A description is not available for this item.
This document references:
IEC 60749-29 - Semiconductor devices – Mechanical and climatic test methods – Part 29: Latch-up test
Published by IEC on April 1, 2011
Scope and object This part of IEC 60749 covers the I-test and the overvoltage latch-up testing of integrated circuits. This test is classified as destructive. The purpose of this test is to establish...
This document references:
IEC 60749-5 - Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
Published by IEC on April 1, 2017
This part of IEC 60749 provides a steady-state temperature and humidity bias life test for the purpose of evaluating the reliability of non-hermetic packaged solid-state devices in humid...
This document references:
JEDEC JEP 122 - Failure Mechanisms and Models for Semiconductor Devices
Published by JEDEC on September 1, 2016
This publication provides a list of failure mechanisms and their associated activation energies or acceleration factors that may be used in making system failure rate estimations when the only...
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