IEC 60749-29
Semiconductor devices – Mechanical and climatic test methods – Part 29: Latch-up test
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| Organization: | IEC |
| Publication Date: | 1 April 2011 |
| Status: | active |
| Page Count: | 52 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
Scope and object
This part of IEC 60749 covers the I-test and the overvoltage latch-up testing of integrated circuits.
This test is classified as destructive.
The purpose of this test is to establish a method for determining integrated circuit (IC) latchup characteristics and to define latch-up failure criteria. Latch-up characteristics are used in determining product reliability and minimizing "no trouble found" (NTF) and "electrical overstress" (EOS) failures due to latch-up.
This test method is primarily applicable to CMOS devices. Applicability to other technologies must be established.
The classification of latch-up as a function of temperature is defined in 3.1 and the failure level criteria are defined in 3.2
Document History
IEC 60749-29
April 1, 2011
Semiconductor devices – Mechanical and climatic test methods – Part 29: Latch-up test
Scope and object
This part of IEC 60749 covers the I-test and the overvoltage latch-up testing of integrated circuits.
This test is classified as destructive.
The purpose of this test is to...
November 1, 2003
Semiconductor devices Mechanical and climatic test methods Part 29:Latch-up test
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