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BSI - BS EN 60749-3

Semiconductor devices - Mechanical and climatic test methods Part 3: External visual examination

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Organization: BSI
Publication Date: 30 November 2017
Status: active
Page Count: 18
ICS Code (Semiconductor devices in general): 31.080.01

Document History

BS EN 60749-3
November 30, 2017
Semiconductor devices - Mechanical and climatic test methods Part 3: External visual examination
A description is not available for this item.
BS EN 60749-3
August 27, 2002
Semiconductor Devices Mechanical and Climatic Test Methods Part 3: External Visual Examination
A description is not available for this item.

References

This document references:
EN 60749-9 - Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
Published by CENELEC on June 1, 2017
The purpose of this part of IEC 60749 is to determine whether the marks on solid state semiconductor devices will remain legible when subjected to the application and removal of labels or the use of...
This document references:
IEC 60749-9 - Semiconductor devices – Mechanical and climatic test methods – Part 9: Permanence of marking
Published by IEC on March 1, 2017
The purpose of this part of IEC 60749 is to determine whether the marks on solid state semiconductor devices will remain legible when subjected to the application and removal of labels or the use of...
This document references:
IEC 62483 - Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices
Published by IEC on September 1, 2013
This International Standard describes the methodology applicable for environmental acceptance testing of tin-based surface finishes and mitigation practices for tin whiskers on semiconductor devices....
This document references:
EN 61340-5-1 - Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements
Published by CENELEC on November 1, 2016
This part of IEC 61340 applies to activities that: manufacture, process, assemble, install, package, label, service, test, inspect, transport or otherwise handle electrical or electronic parts,...
This document is referenced by:
BS EN 60749-34 - Semiconductor devices - Mechanical and climatic test methods Part 34: Power cycling
Published by BSI on February 28, 2011
A description is not available for this item.
This document is referenced by:
BS EN 60749-11 - CORR 1 Semiconductor Devices Mechanical and Climatic Test Methods Part 11: Rapid Change of Temperature Two-Fluid-Bath Method
Published by BSI on September 24, 2002
A description is not available for this item.
This document is referenced by:
BS EN IEC 60749-20 - Semiconductor devices — Mechanical and climatic test methods Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
Published by BSI on October 31, 2020
A description is not available for this item.
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