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JSA - JIS Z 3285

Solder paste for micro-joining - Characteristic test methods for solder paste using fine particles

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Organization: JSA
Publication Date: 20 December 2017
Status: active
ICS Code (Brazing and soldering): 25.160.50

Document History

JIS Z 3285
December 20, 2017
Solder paste for micro-joining - Characteristic test methods for solder paste using fine particles
A description is not available for this item.

References

This document references:
JIS Z 3284-3 - Solder paste - Part 3: Test methods for printability, viscosity, slump and tackiness
Published by JSA on June 20, 2014
This Standard specifies the printability test, viscosity test, slump-in-printing test, slump-in-heating test and tackiness test of the solder past for soldering used for the wiring connection,...
This document references:
JIS Z 3284-1 - Solder paste - Part 1: Kinds and quality classification
Published by JSA on June 20, 2014
This Standard specifies the kinds and quality classification of solder paste to be used in the wiring connection of electrical equipment, electronic equipment, communication equipment or the like,...
This document references:
JIS Z 3001-3 - Welding and allied processes - Vocabulary - Part 3: Soldering and brazing
Published by JSA on March 20, 2008
A description is not available for this item.
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