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JSA - JIS Z 3284-1

Solder paste - Part 1: Kinds and quality classification

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Organization: JSA
Publication Date: 20 June 2014
Status: active
Page Count: 16
ICS Code (Brazing and soldering): 25.160.50
scope:

This Standard specifies the kinds and quality classification of solder paste to be used in the wiring connection of electrical equipment, electronic equipment, communication equipment or the like, and in manufacturing the parts thereof.

NOTE: The International Standard corresponding to this Standard and the symbol of degree of correspondence are as follows.

IEC 61190-1-2 : 2007 Attachment materials for electronic assemblyPart 1-2 : Requirements for soldering pastes for high-quality interconnects in electronics assembly (MOD)

In addition, symbols which denote the degree of correspondence in the contents between the relevant International Standard and JIS are IDT (identical), MOD (modified), and NEQ (not equivalent) according to ISO/IEC Guide 21-1.

Document History

March 23, 2020
Solder paste—Part 1: Kinds and quality classification (Amendment 1)
A description is not available for this item.
JIS Z 3284-1
June 20, 2014
Solder paste - Part 1: Kinds and quality classification
This Standard specifies the kinds and quality classification of solder paste to be used in the wiring connection of electrical equipment, electronic equipment, communication equipment or the like,...

References

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