scope:

This Standard specifies the printability test, viscosity test, slump-in-printing test, slump-in-heating test and tackiness test of the solder past for soldering used for the wiring connection, connection of parts, etc. of electric equipment, electronic equipment, communication equipment, etc.

NOTE: The International Standard corresponding to this Standard and the symbol of degree of correspondence are as follows.

lEC 61189-5 : 2006 Test methods for electrical materials) interconnection structures and assemblies - Part 5 : Test methods for printed board assemblies (MOD)

In addition, symbols which denote the degree of correspondence in the contents between the relevant International Standard and JIS are IDT (identical), MOD (modified), and NEQ (not equivalent) according to ISO/lEC Guide 21-1.