UNLIMITED FREE
ACCESS TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Select Your Free Newsletters

Industry Newsletters

Select Your Free Product Alerts

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

CENELEC - EN 60068-2-69

Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

inactive
Organization: CENELEC
Publication Date: 1 June 2007
Status: inactive
Page Count: 28
ICS Code (Electronic component assemblies): 31.190
ICS Code (Environmental testing): 19.040

Document History

EN 60068-2-69
June 1, 2017
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations....
EN 60068-2-69
June 1, 2017
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations....
EN 60068-2-69
June 1, 2007
Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
A description is not available for this item.
EN 60068-2-69
January 1, 1996
Environmental Testing Part 2: Tests Test Te: Solderability Testing of Electronic Components for Surface Mount Technology by the Wetting Balance Method
A description is not available for this item.

References

This document is referenced by:
BS EN 60068-3-13 - Environmental testing Part 3-13: Supporting documentation and guidance on Test T - Soldering
Published by BSI on September 30, 2016
A description is not available for this item.
This document is referenced by:
EN IEC 60384-1 - Fixed capacitors for use in electronic equipment - Part 1: Generic specification
Published by CENELEC on August 1, 2021
This part of IEC 60384 is a generic specification and is applicable to fixed capacitors for use in electronic equipment. It establishes standard terms, inspection procedures and methods of test for...
This document is referenced by:
BS EN IEC 61760-1 - Surface Mounting Technology Part 1: Standard method for the specification of surface mounting components (SMDs)
Published by BSI on September 30, 2020
A description is not available for this item.
This document is referenced by:
EN 61069-4 - Industrial-process measurement, control and automation - Evaluation of system properties for the purpose of system assessment - Part 4: Assessment of system performance
Published by CENELEC on November 1, 2016
This part of IEC 61069: – specifies the detailed method of the assessment of performance of a basic control system (BCS) based on the basic concepts of IEC 61069-1 and methodology of IEC 61069-2, –...
This document is referenced by:
BS EN 60068-2-58 - Environmental testing Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Published by BSI on May 31, 2015
A description is not available for this item.
View Less
View All
Advertisement