CENELEC - EN 61190-1-2
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
inactive
| Organization: | CENELEC |
| Publication Date: | 1 June 2007 |
| Status: | inactive |
| Page Count: | 22 |
| ICS Code (Electronic component assemblies): | 31.190 |
Document History
May 1, 2014
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
A description is not available for this item.
EN 61190-1-2
June 1, 2007
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
A description is not available for this item.
June 1, 2002
Attachment Materials for Electronic Assembly Part 1-2: Requirements for Solder Pastes for High-Quality Interconnections in Electronic Assembly
A description is not available for this item.