TSE - TS EN 61189-3
Test methods for electrical materials, interconnection structures and assemblies-Part 3:Test methods for interconnection structures (printed boards)
active, Most Current
| Organization: | TSE |
| Publication Date: | 9 April 2009 |
| Status: | active |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
TS EN 61189-3
April 9, 2009
Test methods for electrical materials, interconnection structures and assemblies-Part 3:Test methods for interconnection structures (printed boards)
A description is not available for this item.
April 25, 2006
Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
Bu standard, öngerme çeliklerine (çubuk, tel veya halat). uygulanacak deney metotlarını kapsar
November 4, 1997
Test methods for electrical materials, interconnection structures and assemblies-Part 3:Test methods for interconnection structures (printed boards)
A description is not available for this item.