TSE - TS EN 61189-3
Test methods for electrical materials, interconnection structures and assemblies-Part 3:Test methods for interconnection structures (printed boards)
inactive
| Organization: | TSE |
| Publication Date: | 4 November 1997 |
| Status: | inactive |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
April 9, 2009
Test methods for electrical materials, interconnection structures and assemblies-Part 3:Test methods for interconnection structures (printed boards)
A description is not available for this item.
April 25, 2006
Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
Bu standard, öngerme çeliklerine (çubuk, tel veya halat). uygulanacak deney metotlarını kapsar
TS EN 61189-3
November 4, 1997
Test methods for electrical materials, interconnection structures and assemblies-Part 3:Test methods for interconnection structures (printed boards)
A description is not available for this item.