TSE - TS EN 61189-3/A1
Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
inactive
| Organization: | TSE |
| Publication Date: | 25 April 2006 |
| Status: | inactive |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
Bu standard, öngerme çeliklerine (çubuk, tel veya halat). uygulanacak deney metotlarını kapsar
Document History
April 9, 2009
Test methods for electrical materials, interconnection structures and assemblies-Part 3:Test methods for interconnection structures (printed boards)
A description is not available for this item.
TS EN 61189-3/A1
April 25, 2006
Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
Bu standard, öngerme çeliklerine (çubuk, tel veya halat). uygulanacak deney metotlarını kapsar
November 4, 1997
Test methods for electrical materials, interconnection structures and assemblies-Part 3:Test methods for interconnection structures (printed boards)
A description is not available for this item.