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GMNA - 9984905

Low Bake Adhesion Promoter - Solventborne for TPO

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Organization: GMNA
Publication Date: 1 July 2007
Status: inactive
Page Count: 2
scope:

This specification covers the requirements for a low bake 80°C (180°F) solventborne adhesion promoter for thermoplastic olefins (TPO). The adhesion promoter may be conductive or nonconductive depending on the needs of the user.

This adhesion promoter is part of a total product system and must meet requirements set forth in the specifications for other materials with which it is used. This specification shall be used in conjunction with the Approved Paint on Plastics Systems (APOPS), a section of Materials Specification (MATSPC) file, which lists approved substrate, cleaning, priming, and topcoat combinations.

Specified herein are material requirements per the GM Paint & Polymers Center. These specifications are used to verify the materials have been processed to produce a finished product of quality consistent with that proven in initial qualification testing.

Document History

October 1, 2021
Low Bake Adhesion Promoter - Solventborne for Thermoplastic Polyolefin (TPO)
This specification covers the requirements for a low bake 80 °C (180 °F) solventborne adhesion promoter for Thermoplastic Polyolefin (TPO). The adhesion promoter may be conductive or nonconductive...
September 1, 2017
Low Bake Adhesion Promoter - Solventborne for Thermoplastic Polyolefin (TPO)
This specification covers the requirements for a low bake 80 °C (180 °F) solventborne adhesion promoter for Thermoplastic Polyolefin (TPO). The adhesion promoter may be conductive or nonconductive...
9984905
July 1, 2007
Low Bake Adhesion Promoter - Solventborne for TPO
This specification covers the requirements for a low bake 80°C (180°F) solventborne adhesion promoter for thermoplastic olefins (TPO). The adhesion promoter may be conductive or nonconductive...

References

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