TSE - TS EN 60749-15
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
active
| Organization: | TSE |
| Publication Date: | 13 December 2011 |
| Status: | active |
| ICS Code (Diodes): | 31.080.10 |
Document History
December 13, 2011
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
A description is not available for this item.
TS EN 60749-15
December 13, 2011
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
A description is not available for this item.
April 29, 2008
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
Bu standard, delige monteleme icin kullanilan kapsullenmis yariiletken elemanlarin, dalgali lehim havuzu veya bir lehim havyasikullanilarak bacaklarinin lehimlenmesi esnasinda maruz...
January 28, 2004
Semiconductor devices - Mechanical and climatic test methods -- Part 15: Resistance to soldering temperature for through-hole mounted devices
Bu standard, rahim içinde uzun süre bulunarak gebeliği önleyici etki gösteren rahim içi araçları kapsar. İlaçı rahim içi araçları kapsamaz.