TSE - TS EN 60749-15
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
inactive
| Organization: | TSE |
| Publication Date: | 29 April 2008 |
| Status: | inactive |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
Bu standard, delige monteleme icin kullanilan kapsullenmis yariiletken elemanlarin, dalgali lehim havuzu veya bir lehim havyasikullanilarak bacaklarinin lehimlenmesi esnasinda maruz kaldiklarisicaklik etkilerine dayanip dayanamadigini belirlemek icinkullanilan bir deneyi kapsar
Document History
December 13, 2011
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
A description is not available for this item.
December 13, 2011
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
A description is not available for this item.
TS EN 60749-15
April 29, 2008
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
Bu standard, delige monteleme icin kullanilan kapsullenmis yariiletken elemanlarin, dalgali lehim havuzu veya bir lehim havyasikullanilarak bacaklarinin lehimlenmesi esnasinda maruz...
January 28, 2004
Semiconductor devices - Mechanical and climatic test methods -- Part 15: Resistance to soldering temperature for through-hole mounted devices
Bu standard, rahim içinde uzun süre bulunarak gebeliği önleyici etki gösteren rahim içi araçları kapsar. İlaçı rahim içi araçları kapsamaz.