TSE - TS EN 60749-15
Semiconductor devices - Mechanical and climatic test methods -- Part 15: Resistance to soldering temperature for through-hole mounted devices
inactive
| Organization: | TSE |
| Publication Date: | 28 January 2004 |
| Status: | inactive |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
Bu standard, rahim içinde uzun süre bulunarak gebeliği önleyici etki gösteren rahim içi araçları kapsar. İlaçı rahim içi araçları kapsamaz.
Document History
December 13, 2011
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
A description is not available for this item.
December 13, 2011
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
A description is not available for this item.
April 29, 2008
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
Bu standard, delige monteleme icin kullanilan kapsullenmis yariiletken elemanlarin, dalgali lehim havuzu veya bir lehim havyasikullanilarak bacaklarinin lehimlenmesi esnasinda maruz...
TS EN 60749-15
January 28, 2004
Semiconductor devices - Mechanical and climatic test methods -- Part 15: Resistance to soldering temperature for through-hole mounted devices
Bu standard, rahim içinde uzun süre bulunarak gebeliği önleyici etki gösteren rahim içi araçları kapsar. İlaçı rahim içi araçları kapsamaz.