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BSI - BS EN 61760-2

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

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Organization: BSI
Publication Date: 31 July 2007
Status: active
Page Count: 12
ICS Code (Mechanical structures for electronic equipment): 31.240

Document History

BS EN IEC 61760-2
September 30, 2021
Surface mounting technology Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
A description is not available for this item.
BS EN 61760-2
July 31, 2007
Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
A description is not available for this item.
BS EN 61760-2
June 15, 1998
Surface Mounting Technology - Part 2: Transportation and Storage Conditions of Surface Mounting Devices (SND) - Application Guide
Describes transportation and storage conditions for surface mounting devices (SMDs) to enable their trouble-free processing, without prejudice to quality or reliability.

References

This document references:
IEC 60286-5 - Packaging of components for automatic handling – Part 5: Matrix trays
Published by IEC on April 1, 2018
This part of IEC 60286 describes the common dimensions, tolerances and characteristics of the tray. It includes only those dimensions that are essential for the handling of the trays for the stated...
This document references:
IEC 60721-3-2 - Classification of environmental conditions – Part 3-2: Classification of groups of environmental parameters and their severities – Transportation and handling
Published by IEC on November 1, 2018
A description is not available for this item.
This document references:
IEC 60286-3 - Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
Published by IEC on January 1, 2019
This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those...
This document references:
IEC 60286-6 - Packaging of components for automatic handling Part 6: Bulk case packaging for surface mounting components
Published by IEC on February 1, 2004
A description is not available for this item.
This document is referenced by:
BS EN IEC 61191-1 - Printed Board Assemblies Part 1: Generic Specification - Requirements for Soldered Electrical and Electronic Assemblies Using Surface Mount and Related Assembly Technologies
Published by BSI on November 30, 2018
A description is not available for this item.
This document is referenced by:
BS EN IEC 61760-3 - Surface mounting technology Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering
Published by BSI on March 31, 2021
A description is not available for this item.
This document is referenced by:
BS EN IEC 60115-1 - Fixed resistors for use in electronic equipment Part 1: Generic specification
Published by BSI on March 31, 2023
A description is not available for this item.
This document is referenced by:
BS EN IEC 61760-1 - Surface Mounting Technology Part 1: Standard method for the specification of surface mounting components (SMDs)
Published by BSI on September 30, 2020
A description is not available for this item.
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