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BSI - BS EN IEC 61760-2

Surface mounting technology Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

active, Most Current
Organization: BSI
Publication Date: 30 September 2021
Status: active
Page Count: 22
ICS Code (Electronic components in general): 31.020
ICS Code (Mechanical structures for electronic equipment): 31.240

Document History

BS EN IEC 61760-2
September 30, 2021
Surface mounting technology Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
A description is not available for this item.
BS EN 61760-2
July 31, 2007
Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
A description is not available for this item.
BS EN 61760-2
June 15, 1998
Surface Mounting Technology - Part 2: Transportation and Storage Conditions of Surface Mounting Devices (SND) - Application Guide
Describes transportation and storage conditions for surface mounting devices (SMDs) to enable their trouble-free processing, without prejudice to quality or reliability.

References

This document references:
EN 60286-4 - Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
Published by CENELEC on November 1, 2013
This part of IEC 60286 is applicable to stick magazines (including end stoppers) intended to be used for storage of electronic components, for transport from the manufacturer to the customer and for...
This document references:
EN 60286-6 - Packaging of components for automatic handling Part 6: Bulk case packaging for surface mounting components
Published by CENELEC on March 1, 2004
A description is not available for this item.
This document references:
EN 61760-4 - Surface mounting technology – Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
Published by CENELEC on July 1, 2015
This part of IEC 61760 specifies the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling and handling....
This document references:
EN 61340-5-1 - Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements
Published by CENELEC on November 1, 2016
This part of IEC 61340 applies to activities that: manufacture, process, assemble, install, package, label, service, test, inspect, transport or otherwise handle electrical or electronic parts,...
This document references:
EN IEC 60286-3 - Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
Published by CENELEC on December 1, 2022
This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those...
This document is referenced by:
BS EN IEC 61760-3 - Surface mounting technology Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering
Published by BSI on March 31, 2021
A description is not available for this item.
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