NEN-EN-IEC 62137/C11
Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
inactive, Most Current
| Organization: | NEN |
| Publication Date: | 1 July 2005 |
| Status: | inactive |
| Page Count: | 5 |
| ICS Code (Electronic component assemblies): | 31.190 |
Document History
NEN-EN-IEC 62137/C11
July 1, 2005
Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
A description is not available for this item.
August 1, 2004
Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
Specifies the test method and guidelines for evaluating the quality and reliability of boards, solder lands, solder process and solder joints of reflow solder mounted area array type packages and...