scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and Appendix F of MIL-PRF-38535, "General provisions for TAB microcircuits" and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 320C31 Digital signal processor, 27 Mhz 1/ 02 320C31 Digital signal processor, 33 MHz 03 320C31 Digital signal processor, 40 MHz 04 320C31 Digital signal processor, 50 MHz

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A and Appendix F of MIL-PRF-38535. Q or V Certification and qualification to MIL-PRF-38535 and Appendix F of MIL-PRF- 38535.

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X See figure 1 141 Pin grid array Y See figure 1 132 Quad flatpack with non-conductive tie bar Z See figure 1 132 Tape automated bond U See figure 1 132 Environmentally protected tape automated bond

The lead finish is as specified in MIL-PRF-38535 and Appendix F of MIL-PRF-38535, for device classes Q and V or MIL-PRF-38535, appendix A and Appendix F of MIL-PRF-38535 for device class M.

Supply voltage range (V_DD) 3/ ..................... −0.3 V dc to 7.0 V dc Input voltage range ................................ −0.3 V dc to 7.0 V dc Output voltage range ............................... −0.3 V dc to 7.0 V dc Continuous power dissipation 4/ ................... 3.15 W Storage temperature range .......................... −65° C to +150° C Thermal resistance, junction to case (Θ_JC): Case X ............................................ 4.25° C/W Cases Y ........................................... 2.13° C/W Maximum die temperature rise for the die at 100% Cases Z and U ..................................... 0.9° C/W

Supply voltages (V_DD): Device type 01 and 02 ............................. 4.5 V dc min to 5.5 V dc max Device type 03 and 04 ............................. 4.75 V dc min to 5.25 V dc max Supply voltages (CVSS, etc.)(V_SS) .................. 0 V dc nominal High level input voltage (V_IH) 5/ .................. 2.1 V dc min to V_DD+0.3 V dc max Low level input voltage (V_IL) 5/.................... −0.3 V dc min to 0.8 V dc max High level output current (I_OH) .................... −300 µA max Low level output current (I_OL) ..................... 2mA max CLKIN high level input voltage (V_TH) 5/............. 3.0 V dc Min to V_DD+0.3 V dc max Operating case temperature (T_C) ................... −55° C min to +125° C max

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) ...... XX percent6/

intended Use: