BSI - BS EN 60191-6-13
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)
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| Organization: | BSI |
| Publication Date: | 31 January 2008 |
| Status: | inactive |
| Page Count: | 18 |
| ICS Code (Electrical and electronics engineering drawings): | 01.100.25 |
| ICS Code (Printed circuits and boards): | 31.180 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
December 31, 2016
Mechanical standardization of semiconductor devices Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
A description is not available for this item.
BS EN 60191-6-13
January 31, 2008
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)
A description is not available for this item.
References
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