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IPC/ECA J-STD-002

Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

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Organization: IPC
Publication Date: 1 December 2007
Status: inactive
Page Count: 64
scope:

This standard prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs, and tabs. This standard also includes a test method for the Resistance to Dissolution/Dewetting of Metallization. This standard is intended for use by both vendor and user.

Document History

IPC/ECA J-STD-002
November 1, 2017
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
This standard prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded...
IPC/ECA J-STD-002
March 1, 2014
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
A description is not available for this item.
IPC/ECA J-STD-002
June 1, 2013
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
This standard prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded...
IPC/ECA J-STD-002
October 1, 2008
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires Amendment 1
This standard prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded...
IPC/ECA J-STD-002
December 1, 2007
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
This standard prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded...
IPC/ECA J-STD-002
December 1, 2007
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
This standard prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded...
J-STD-002B
February 1, 2003
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
This standard prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wire, stranded...
J-STD-002A
October 1, 1998
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
A description is not available for this item.
IPC/ECA J-STD-002
January 1, 1992
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
A description is not available for this item.
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References

This document references:
IPC-TR-464 - Accelerated Aging for Solderability Evaluations
Published by IPC on April 1, 1984
ABSTRACT There is a growing need for a method of evaluating the solderability retention capability of printed circuit parts during inventory storage. These circuit parts, including components,...
This document references:
A-A-59551 - WIRE, ELECTRICAL, COPPER (UNINSULATED)
Published by NPFC on October 6, 2020
This commercial item description (CID) covers the general requirements for solid, bunch-stranded, concentric-lay-stranded, and rope-lay-stranded round, uninsulated, copper conductors for use in...
This document references:
IEC 60068-2-69 - Environmental testing – Part 2-69: Tests – Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
Published by IEC on June 1, 2019
This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations....
This document references:
J-STD-004 - Requirements for Soldering Fluxes
Published by IPC on November 1, 2011
A description is not available for this item.
This document references:
J-STD-005 - Requirements for Soldering Pastes
Published by IPC on February 1, 2012
This standard prescribes general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections. This specification is a material quality...
This document references:
J-STD-006 - Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
Published by IPC on July 1, 2013
This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, wire, and powder solders, for electronic soldering...
This document references:
IPC-T-50 - Terms and Definitions for Interconnecting and Packaging Electronic Circuits
Published by IPC on May 1, 2015
This document is designed to provide definitions for terms commonly used in the electronics industry which have meanings specific to electronics. The definitions are intended to provide sufficient...
This document is referenced by:
IPC-A-610 CZECH - Acceptability of Electronic Assemblies
Published by IPC on October 1, 2017
A description is not available for this item.
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