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IPC/ECA J-STD-002

Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

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Organization: IPC
Publication Date: 1 March 2014
Status: inactive
Page Count: 2

Document History

IPC/ECA J-STD-002
November 1, 2017
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
This standard prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded...
IPC/ECA J-STD-002
March 1, 2014
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
A description is not available for this item.
IPC/ECA J-STD-002
June 1, 2013
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
This standard prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded...
IPC/ECA J-STD-002
October 1, 2008
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires Amendment 1
This standard prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded...
IPC/ECA J-STD-002
December 1, 2007
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
This standard prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded...
IPC/ECA J-STD-002
December 1, 2007
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
This standard prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded...
J-STD-002B
February 1, 2003
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
This standard prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wire, stranded...
J-STD-002A
October 1, 1998
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
A description is not available for this item.
IPC/ECA J-STD-002
January 1, 1992
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
A description is not available for this item.
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References

This document references:
IEC 60068-2-69 - Environmental testing – Part 2-69: Tests – Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
Published by IEC on June 1, 2019
This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations....
This document references:
J-STD-004 - Requirements for Soldering Fluxes
Published by IPC on November 1, 2011
A description is not available for this item.
This document references:
T-50N - Terms and Definitions for Interconnecting and Packaging Electronic Circuits
Published by IPC on November 1, 2021
This document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing...
This document references:
J-STD-006 - Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications Amendment 1
Published by IPC on October 1, 2017
A description is not available for this item.
This document references:
J-STD-005 - Requirements for Soldering Pastes
Published by IPC on February 1, 2012
This standard prescribes general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections. This specification is a material quality...
This document is referenced by:
ANSI/NEMA WC 67 - Uninsulated Conductors — Used in Electrical and Electronic Applications
Published by NEMA on January 1, 2015
This standard covers the following uninsulated conductors: a) Single end (solid) and stranded; b) coated and uncoated copper; c) coated copper alloy; d) coated copper-clad steel; e) aluminum...
This document is referenced by:
IPC-A-610 - Acceptability of Electronic Assemblies
Published by IPC on October 1, 2017
This Standard is a collection of visual quality acceptability requirements for electronic assemblies. This Standard does not provide criteria for cross-section evaluation. This document presents...
This document is referenced by:
IEC 61191-1 - Printed board assemblies – Part 1: Generic specification – Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Published by IEC on September 1, 2018
This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly...
This document is referenced by:
IEC 60810 - Lamps, light sources and led packages for road vehicles – Performance requirements
Published by IEC on April 1, 2019
This document is applicable to filament lamps, discharge lamps, LED light sources and LED packages to be used in road vehicles, i.e. in headlamps, fog-lamps, signalling lamps and interior lighting....
This document is referenced by:
IPC-HDBK-001 - Handbook and Guide to Supplement J-STD-001
Published by IPC on January 1, 2021
This Handbook is a companion reference to the J-STD-001 (standard) and is intended to provide supporting information. Additional detailed information can be found in documents referenced within the...
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