scope:

IPC C-103 is a hardcopy compilation of IPC documents of guidelines for adhesives used in assembly of printed circuit boards. Documents were reviewed and recommended for inclusion by IPC's technical staff.

These IPC documents can be viewed individually through the appropriate IPC subscriptions in IHS Standards Expert.

2611: Generic Requirements for Electronic Product Documentation

2612: Sectional Requirements for Electronic Diagramming Documentation (schematic and Logic Description)

2612-1: Sectional Requirements for Electronic diagramming Synbol Generation Methodology

3406: Guidelines for Electrically Conductive Surface Mount Adhesives

3408: General Requirements for anisotropically Conductive Adhesives Films

7095B: Design and Assembly Process Implementation for BGAs

7351B: Generic Requirements for Surface Mount Design and Land Pattern Standard

9202: Material and Process Characterization/Qualifiaation Test Protocol and Assessing Electrochemical

9203: Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle

9701A: Performance Test Methods and Qualification Requirements for Surface Mount Soulder Attachements

9702: IPC/JEDEC Monotonic Bend Characterization of Board-Level Interconnects

9703: IPCJEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability

9704A: Printed Circuit Assembly Strain Gage Test Guideline

9707: Spherical Bend Test Method for Characterization of Board Level Interconnects

9708: Test Methods for Charaterization of Printed Board Assembly Pad Cratering

A-610E: Acceptability of Electronic Assemblies

A-620A: Requirements and Acceptance for Cable and Wire Harness Assemblies

A-620AS: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A

C-406: Design & Application Guidelines for Surface Mount Connectors

CA-821: General Requirements for Thermally Conductive Adhesives

CC-830B: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assembly

CM-770E: Component Mounting Guidelines for Printed Boards

D-326A: Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Assembly

HDBK-001E: Handbook and Guide to Supplement J-STD-001

HDBK-005: Guide to Solder Paste Assessment

JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline

J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies

J-STD-002C: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

J-STD-003B: Solderability Tests for Printed Boards

J-STD-004B: Requirements for Soldering Fluxes

J-STD-005A: Requirements for Soldering Pastes

J-STD-006B: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders

J-STD-012: Implementation of Flip Chip & Chip Scale Technology

J-STD-020D-1: IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surf

J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configureations

J-STD-028: Performance Standard for Construction of Flip Chip and Chip Scale Bumps

J-STD-030: Guideline for Selection and Application of Underfill Material for Flip Chip

J-STD-033C: Handling, Packing, Shipping, and Use of Moisture/Reflow and/or Process Sensitie Components

J-STD-075: Classification of Non-IC Electronic Components for Assembly Processes

MC-790: Guidelines for Multichip Module Technolgy Utilization

S-816: SMT Process Guideline & Checklist

SM-780: Component Packaging & Interconnecting with Emphasis on Surface Mounting

SM-784: Guidelines for Chip-on-Board Technoloty Implementation

SM-785: Guidelines for Accelerated Reliability Testing of Surface Mount Attachments

SM-817: General Requiremnts for Dielectric Surface Mounting Adhesives

T-50J: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

TR-001: An Introduction to Tape Automated Bonding Fine Pitch Technology