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IPC-7351 GERMAN

Generic Requirements for Surface Mount Design and Land Pattern Standard

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Organization: IPC
Publication Date: 1 February 2007
Status: inactive
Page Count: 125
scope:

Dieses Dokument enthält Informationen über die Geome-trien der Anschlussflächen-Bilder (Land Pattern) für die Oberflächenmontage elektronischer Bauelemente. Ziel der gegebenen Informationen ist es, Angaben über die geeignete Größe, Form und Toleranz der Anschlussflächen-Bilder für oberflächenmontierte Bauelemente an die Hand zu geben, um sicherzustellen, dass eine ausreichende Fläche zur Ausbildung von Lotmenisken zur Verfügung steht, die den Anforderungen der IPC J-STD-001 entspricht.

Document History

IPC-7351 GERMAN
June 1, 2010
Generic Requirements for Surface Mount Design and Land Pattern Standard
Dieses Dokument enthält Informationen über die Geome-trien der Anschlussflächen-Bilder (Land Pattern) für die Oberflächenmontage elektronischer Bauelemente. Ziel der gegebenen Informationen ist es,...
IPC-7351 GERMAN
February 1, 2007
Generic Requirements for Surface Mount Design and Land Pattern Standard
Dieses Dokument enthält Informationen über die Geome-trien der Anschlussflächen-Bilder (Land Pattern) für die Oberflächenmontage elektronischer Bauelemente. Ziel der gegebenen Informationen ist es,...

References

This document references:
IPC-S-816 - SMT Process Guideline and Checklist
Published by IPC on July 1, 1993
This document is intended to provide guidelines and assistance in performing and troubleshooting the steps involved in the process of producing printed wiring assemblies incorporating surface...
This document references:
IPC-2226 - Sectional Design Standard for High Density Interconnect (HDI) Printed Boards
Published by IPC on September 1, 2017
This standard establishes requirements and considerations for the design of organic and inorganic high density interconnect (HDI) printed boards and structures for component mounting and...
This document references:
IPC-SM-785 - Guidelines for Accelerated Reliability Testing of Surface Mount Solder Attachments
Published by IPC on November 1, 1992
This document provides guidelines for accelerated reliability testing of surface mount solder attachments and for evaluating and extrapolating the results of these accelerated reliability tests...
This document references:
IPC-2221 - Generic Standard on Printed Board Design
Published by IPC on June 1, 2018
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