scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator.Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number 1/ Circuit function Access time 01 4K × 9 CMOS Parallel Synchronous FIFO 50 ns 02 4K × 9 CMOS Parallel Synchronous FIFO 35 ns 03 4K × 9 CMOS Parallel Synchronous FIFO 25 ns 04 4K × 9 CMOS Parallel Synchronous FIFO 20 ns

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X CQCC1-N32 32 Rectangular leadless chip carrier

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Terminal voltage with respect to ground .......... −0.5 V dc to +7.0 V dc DC output current ................................ 50 mA Storage temperature range ........................ −65°C to +135°C Maximum power dissipation (P_D) ................... 1.25 W Lead temperature (soldering, 10 seconds) ......... +260°C Thermal resistance, junction-to-case (θ_JC): Case X ......................................... See MIL-STD-1835 Junction temperature (T_J) ........................ +175°C

Supply voltage (V_CC) ............................. 4.5 V dc to 5.5 V dc Supply voltage (GND) ............................. 0 V Input high voltage (V_IH).......................... 2.2 V dc minimum Input low voltage (V_IL)........................... 0.8 V dc maximum Case operating temperature range (T_C) ............ −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) ............ 3/ percent

intended Use: