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JEDEC JEP 157

Recommended ESD-CDM Target Levels

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Organization: JEDEC
Publication Date: 1 October 2009
Status: active
Page Count: 128
scope:

This document was written with the intent to provide information for quality organizations in both semiconductor companies and their customers to assess and make decisions on safe ESD CDM level requirements.

Document History

JEP157A
April 1, 2022
Recommended ESD-CDM Target Levels
The intent of this report is to document and provide critical information to assess and make decisions on safe CDM ESD level requirements. The scope of this document is to provide this information to...
JEDEC JEP 157
October 1, 2009
Recommended ESD-CDM Target Levels
This document was written with the intent to provide information for quality organizations in both semiconductor companies and their customers to assess and make decisions on safe ESD CDM level...

References

This document references:
IEC 61340-5-1 - Electrostatics – Part 5-1: Protection of electronic devices from electrostatic phenomena – General requirements
Published by IEC on May 1, 2016
This part of IEC 61340 applies to activities that: manufacture, process, assemble, install, package, label, service, test, inspect, transport or otherwise handle electrical or electronic parts,...
This document references:
IEC 61000-4-2 - Electromagnetic compatibility (EMC) – Part 4-2: Testing and measurement techniques – Electrostatic discharge immunity test
Published by IEC on December 1, 2008
This International Standard relates to the immunity requirements and test methods for electrical and electronic equipment subjected to static electricity discharges, from operators directly, and to...
This document references:
ESD S20.20 - the Development of an Electrostatic Discharge Control Program for - Protection of Electrical and Electronic Parts, Assemblies, and Equipment (Excluding Electrically Initiated Explosive Devices)
Published by ESD on June 11, 2014
This document applies to activities that manufacture, process, assemble, install, package, label, service, test, inspect, transport or otherwise handle electrical or electronic parts, assemblies and...
This document is referenced by:
JEDEC JEP 143 - Solid-State Reliability Assessment and Qualification Methodologies
Published by JEDEC on January 1, 2019
This publication applies to all integrated circuits and their associated packages. The document summarizes the suite of reliability documents and publications available. These documents address...
This document is referenced by:
JEDEC JEP 162 - System Level ESD Part II: Implementation of Effective ESD Robust Designs
Published by JEDEC on January 1, 2013
This white paper consolidates industry-wide knowledge and experience on the tools and methods used to address failures of printed circuit boards (PCBs) which occur as a result of IEC 61000-4-2...
This document is referenced by:
JEDEC JESD 88 - JEDEC Dictionary of Terms for Solid State Technology
Published by JEDEC on July 1, 2007
Each term and definition in this dictionary has been included strictly for application within the solid-state industry. Many of the terms and definitions in this dictionary may have applicability...
This document is referenced by:
DSCC-DWG-V62/14615 REV A - MICROCIRCUIT, LINEAR, DC MOTOR DRIVER IC, MONOLITHIC SILICON
Published by DLA on October 7, 2020
Scope. This drawing documents the general requirements of a high performance DC motor driver integrated circuit (IC) microcircuit, with an operating temperature range of -55ºC to +125ºC.
This document is referenced by:
DSCC-DWG-V62/14616 REV A - MICROCIRCUIT, LINEAR, VAUX POWER DISTRIBUTION SWITCH, MONOLITHIC SILICON
Published by DLA on May 13, 2021
Scope. This drawing documents the general requirements of a high performance VAUX power distribution switch microcircuit, with an operating temperature range of -55°C to +125°C.
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