scope:

This document specifies Acceptance and Testing Requirements for Pb-free circuit packs. Circuit pack testing may be done on a representative product, and is not required on derivative circuit packs provided there is sufficient similarity in terms of size, component types, printed wiring board structure and materials, etc. This document exclusively focuses on those issues specific to Pb-free assembly and the introduction of Pb-free components into circuit packs, and does not address requirements for product specific qualification.

Purpose

Telecom product that is eligible for the "Network Infrastructure Equipment" Pb-in-solder exemption (EU RoHS Directive exemption 7b) should continue to be manufactured using SnPb solder as referenced in GR-78-Core. In view of reliability concerns, telecom service providers require qualification of RoHS6 circuit packs (i.e. those assembled with Pb-free solder) as defined below. This document provides a set of methods and requirements for telecom industry qualification testing to determine acceptability of RoHS6 circuit packs.

Application

This document (and supporting documentation) is intended to be used by equipment manufacturers wishing to deploy carrier network equipment comprised of circuit packs using a solder composition other than SnPb (tin-lead) solder. For subassembly modules, e.g. optical modules, power modules, refer to ATIS Standard ATIS-0600019.2009 TEST REQUIREMENTS FOR PB-FREE SUBASSEMBLY MODULES.