scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 54ABT16500 18-bit universal bus transceiver with three- state outputs, TTL compatible inputs

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1 835 and as follows:

Outline letter Descriptive designator Terminals Package style X GDFP1-F56 56 Flat pack

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage range (V_CC) ..................................................... −0.5 V dc to +7.0 V dc DC input voltage range (V_IN) (except I/O port)................................... −0.5 V dc to +7.0 V dc 4/ DC output voltage range (V_OUT): In the disabled or power off state ............................................. −0.5 V dc to +5.5 V dc 4/ In the high state .............................................................. −0.5 V dc to V_CC 4/ DC output current applied to output in the low state (I_OL) (per output) ......... +96 mA DC input clamp current (I_IK) (V_IN < 0.0 V) ...................................... −18 mA DC output clamp current (I_OK) (V_OUT < 0.0 V) .................................... −50 mA Maximum power dissipation at (P_D) ............................................... 500 mW Storage temperature range (T_STG) ................................................ −65°C to +150°C Lead temperature (soldering, 10 seconds) ........................................ +300°C Thermal resistance, junction-to-case (Θ_JC) ...................................... See MIL-STD-1835 Junction temperature (T_J) ....................................................... +175°C

Supply voltage range (V_CC) ...................................................... +4.5 V dc to +5.5 V dc Input voltage range (V_IN) ....................................................... 0.0 V dc to V_CC Output voltage range (V_OUT) ..................................................... 0.0 V dc to V_CC Minimum high level input voltage (V_IH) .......................................... 2.0 V Maximum low level input voltage (V_IL) ........................................... 0.8 V Maximum high level output current (I_OH) ......................................... −24 mA Maximum low level output current (I_OL) .......................................... 48 mA Maximum input rise and fall rate (Δt/ΔV)(outputs enabled) ....................... 10 ns/V Operating case temperature range (T_C) ........................................... 55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) .................................. XX percent 6/

intended Use: