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DLA - DSCC-VID-V62/09629

MICROCIRCUIT, DIGITAL, FIXED POINT DIGITAL SIGNAL PROCESSOR, MONOLITHIC SILICON

inactive
Organization: DLA
Publication Date: 10 February 2010
Status: inactive
Page Count: 48
scope:

This drawing documents the general requirements of a high performance Fixed-Point Digital Signal Processor microcircuit, with an operating temperature range of -40°C to +125°C.

Document History

DSCC-VID-V62/09629 REV B
October 18, 2023
MICROCIRCUIT, DIGITAL, FIXED POINT DIGITAL SIGNAL PROCESSOR, MONOLITHIC SILICON
A description is not available for this item.
DSCC-VID-V62/09629 REV A
October 2, 2017
MICROCIRCUIT, DIGITAL, FIXED POINT DIGITAL SIGNAL PROCESSOR, MONOLITHIC SILICON
A description is not available for this item.
DSCC-VID-V62/09629
February 10, 2010
MICROCIRCUIT, DIGITAL, FIXED POINT DIGITAL SIGNAL PROCESSOR, MONOLITHIC SILICON
This drawing documents the general requirements of a high performance Fixed-Point Digital Signal Processor microcircuit, with an operating temperature range of -40°C to +125°C.

References

This document references:
JEP95 BOOK 1 - Book One Registered and Standard Outlines for Solid State and Related Products
Published by JEDEC on March 1, 1997
PREFACE This Publication contains those solid state product outlines and other associated drawings that have been registered and assigned a JEDEC designation and are printed on white paper. Product...
This document references:
JEDEC JESD 51-2 - Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
Published by JEDEC on January 1, 2008
This document outlines the environmental conditions necessary to ensure accuracy and repeatability for a standard junction-to-ambient thermal resistance measurement in natural convection.
This document references:
JEDEC JESD 51-3 - Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
Published by JEDEC on August 1, 1996
This standard describes design requirements for a single layer, leaded surface mount integrated circuit package thermal test board. The standard describes board material and geometry requirements,...
This document references:
JEDEC JESD 51-7 - High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
Published by JEDEC on February 1, 1999
This fixturing further defines the environment for thermal test of packaged microelectronic devices. Its function is to provide an alternate mounting surface for the analysis of heat flow in...
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