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BSI - BS IEC 60747-14-5

Semiconductor devices Part 14-5: Semiconductor sensors PN-junction semiconductor temperature sensor

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Organization: BSI
Publication Date: 30 April 2010
Status: active
Page Count: 22
ICS Code (Semiconductor devices in general): 31.080.01

Document History

BS IEC 60747-14-5
April 30, 2010
Semiconductor devices Part 14-5: Semiconductor sensors PN-junction semiconductor temperature sensor
A description is not available for this item.

References

This document references:
IEC 60747-14-1 - Semiconductor devices – Part 14-1: Semiconductor sensors – Generic specification for sensors
Published by IEC on January 1, 2010
This part of IEC 60147-14 describes general items concerning the specifications for sensors, which are the basis for specifications given in other parts of this series for various types of sensors....
This document references:
IEC 60721-3-1 - Classification of environmental conditions – Part 3-1: Classification of groups of environmental parameters and their severities – Storage
Published by IEC on February 1, 2018
This part of IEC 60721 classifies the groups of environmental parameters and their severities to which products together with their packaging, if any, are subjected when stored. The environmental...
This document references:
IEC 60749-36 - Semiconductor devices Mechanical and climatic test methods Part 36: Acceleration, steady state
Published by IEC on February 1, 2003
A description is not available for this item.
This document references:
IEC 60749-5 - Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
Published by IEC on April 1, 2017
This part of IEC 60749 provides a steady-state temperature and humidity bias life test for the purpose of evaluating the reliability of non-hermetic packaged solid-state devices in humid...
This document references:
IEC 60721-3-0 - Classification of environmental conditions – Part 3-0: Classification of groups of environmental parameters and their severities – Introduction
Published by IEC on May 1, 2020
This part of IEC 60721 provides guidance on the use of all parts of IEC 60721-3. It contains background information including information on the application and limitation of the classes given in...
This document references:
IEC 60747-1 - Semiconductor devices – Part 1: General
Published by IEC on August 1, 2010
This part of IEC 60747 gives the general requirements applicable to the discrete semiconductor devices and integrated circuits covered by the other parts of IEC 60747 and IEC 60748 (see Annex A).
This document references:
IEC 60749-1 - Semiconductor devices – Mechanical and climatic test methods – Part 1: General
Published by IEC on August 1, 2002
A description is not available for this item.
This document references:
IEC 60749-6 - Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
Published by IEC on March 1, 2017
The purpose of this part of IEC 60749 is to test and determine the effect on all solid state electronic devices of storage at elevated temperature without electrical stress applied. This test is...
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