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CENELEC - EN 60191-6

Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

active, Most Current
Organization: CENELEC
Publication Date: 1 December 2009
Status: active
Page Count: 42
ICS Code (Semiconductor devices in general): 31.080.01
scope:

This part of IEC 60191 gives general rules for the preparation of outline drawings of surfacemounted semiconductor devices. It supplements IEC 60191-1 and IEC 60191-3. It covers all surface-mounted devices discrete semiconductors with lead count of greater or equal to 8, as well as integrated circuits classified as form E in Clause 3 of IEC 60191-4.

Document History

EN 60191-6
December 1, 2009
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
This part of IEC 60191 gives general rules for the preparation of outline drawings of surfacemounted semiconductor devices. It supplements IEC 60191-1 and IEC 60191-3. It covers all surface-mounted...
December 1, 2004
Mechanical standardization of semiconductor devices Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
A description is not available for this item.

References

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